[11] M. C. Lee, S. H. Chung, S. M. Jang, M. S. Joun, 2009, “Three-dimensional simulation of forging using tetrahedral and hexahedral elements”, Finite Elements in Analysis and Design, 745-754 Category: Papers
10] M. S. Joun, H. G. Moon, I. S. Choi, M. C. Lee, B. Y. Jun, 2009, “Effects of friction laws on metal forming processes”, Tribology International, 311~319 Category: Papers
[9] Q. S. Li, J. G. Eom, Y. S. Kim, E.Z. Kim, M.S. Joun, 2010, “Causes of die fracture in automatic multistage cold-forging of high-strength ball-studs”, Steel Research International, 266~269 Category: Papers
[8] S. S. Han, J. G. Eom, S. T. Ahn, S. M. Jang, Y. H. Son, H. Kim, D. J. Yoon, M. S. Joun, 2010, “Plastic Deformation Behavior of Pre-Heat-Treated High-Strength Steel for Application in Forging”, Steel Research International, 250~253 Category: Papers
[7] M. C. Lee, S. J. Jang, S. S. Han, D. J. Yoon, M. S. Joun, 2010, “New finite-element model of thread rolling”, Steel Research International, 214~217 Category: Papers
[6] J. G. Eom, Y. H. Son, S. W. Jeong, S. T. Ahn, S. M. Jang, D. J. Yoon, M. S. Joun, 2013, “Effect of strain hardening capability on plastic deformation behaviors of material during metal forming”, Materials and Design, 1010-1018 Category: Papers
[5] B. S. Kim, H. K. Moon, E. Z. Kim, M. H. Choi, M. S. Joun, 2013, “A dual-mesh approach to ring-rolling simulations with emphasis on remeshing”, Journal of Manufacturing Processes, 635-643 Category: Papers
[4] J. G. Eom, M. C. Kim, S. W. Lee, H. Y. Ryu, M. S. Joun, 2014, “Evaluation of Damage Models by Finite Element Prediction of Fracture in Cylindrical Tensile Test”, Journal of Nanoscience and Nanotechnology, 8019-8023 Category: Papers
[3] W. J. Chung, B. S. Kim, S. W. Lee, H. Y. Ryu, M. S. Joun, 2014, “Finite element simulation of plate or sheet metal forming processes using tetrahedral MINI- elements”, Journal of Mechanical Science and Technology, 237-243 Category: Papers
[2] J. M. Cho, Y. D. Jung, M. C. Lee, M. S. Joun, 2014, “Computationally efficient finite element model for simulating a chipless flow-forming process”, Int. J. Materials and Product Technology, 258-269 Category: Papers
